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For decades, people have searched for ways to harvest energy from natural sources. Lately, a desire to address the issue of global warming and climate change has popularized solar or photovoltaic technology, while piezoelectric technology is being developed to power handheld devices without batteries, and thermoelectric technology is being explored to convert wasted heat, such as in automobile engine combustion, into electricity. Featuring contributions from international researchers in both academics and industry, Energy Harvesting with Functional Materials and Microsystems explains the growing field of energy harvesting from a materials and device perspective, with resulting technologies capable of enabling low-power implantable sensors or a large-scale electrical grid. In addition to the design, implementation, and components of energy-efficient electronics, the book covers current advances in energy-harvesting materials and technology, including: High-efficiency solar technologies with lower cost than existing silicon-based photovoltaics Novel piezoelectric technologies utilizing mechanical energy from vibrations and pressure The ability to harness thermal energy and temperature profiles with thermoelectric materials Whether you’re a practicing engineer, academician, graduate student, or entrepreneur looking to invest in energy-harvesting devices, this book is your complete guide to fundamental materials and applied microsystems for energy harvesting.

Technology/Engineering/Mechanical A bestselling MEMS text...now better than ever. An engineering design approach to Microelectromechanical Systems, MEMS and Microsystems remains the only available text to cover both the electrical and the mechanical aspects of the technology. In the five years since the publication of the first edition, there have been significant changes in the science and technology of miniaturization, including microsystems technology and nanotechnology. In response to the increasing needs of engineers to acquire basic knowledge and experience in these areas, this popular text has been carefully updated, including an entirely new section on the introduction of nanoscale engineering. Following a brief introduction to the history and evolution of nanotechnology, the author covers the fundamentals in the engineering design of nanostructures, including fabrication techniques for producing nanoproducts, engineering design principles in molecular dynamics, and fluid flows and heat transmission in nanoscale substances. Other highlights of the Second Edition include: * Expanded coverage of microfabrication plus assembly and packaging technologies * The introduction of microgyroscopes, miniature microphones, and heat pipes * Design methodologies for thermally actuated multilayered device components * The use of popular SU-8 polymer material Supported by numerous examples, case studies, and applied problems to facilitate understanding and real-world application, the Second Edition will be of significant value for both professionals and senior-level mechanical or electrical engineering students.

Microsystems and MEMS technology represents one of the biggest breakthroughs in the area of mechanical and electronic technology to occur in recent years. This is the technology of extremely small and powerful devices – and systems built around such devices – which have mechanical and electrical components. MEMS technology is beginning to explode, with major application areas being telecommunications, biomedical technology, manufacturing and robotic systems, transportation and aerospace. Academics are desperate for texts to familiarize future engineers with this broad-ranging technology. Hsu's MEMS & MICROSYSTEMS text provides an engineering design approach to MEMS and microsystems, appropriate for professionals and senior level students. This design approach is conveyed through good examples, cases, and applied problems. The book is appropriate for Mechanical and Aerospace engineers, since it carefully explains the electrical/electronic aspects of the subject. Electrical Engineering students will be provided strong coverage of the mechanical side of MEMS, something they may not receive from other courses in their curriculum.

Technology/Engineering/Mechanical A bestselling MEMS text...now better than ever. An engineering design approach to Microelectromechanical Systems, MEMS and Microsystems remains the only available text to cover both the electrical and the mechanical aspects of the technology. In the five years since the publication of the first edition, there have been significant changes in the science and technology of miniaturization, including microsystems technology and nanotechnology. In response to the increasing needs of engineers to acquire basic knowledge and experience in these areas, this popular text has been carefully updated, including an entirely new section on the introduction of nanoscale engineering. Following a brief introduction to the history and evolution of nanotechnology, the author covers the fundamentals in the engineering design of nanostructures, including fabrication techniques for producing nanoproducts, engineering design principles in molecular dynamics, and fluid flows and heat transmission in nanoscale substances. Other highlights of the Second Edition include: * Expanded coverage of microfabrication plus assembly and packaging technologies * The introduction of microgyroscopes, miniature microphones, and heat pipes * Design methodologies for thermally actuated multilayered device components * The use of popular SU-8 polymer material Supported by numerous examples, case studies, and applied problems to facilitate understanding and real-world application, the Second Edition will be of significant value for both professionals and senior-level mechanical or electrical engineering students.

LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies―wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing