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Flux-filled, lead-free soft solder wire for electronics production Flux type according to DIN EN 61190: REM1, according to DIN EN 29454: 1.2.2.BHigh-quality lead-free solder wire for manual and automatic soldering in electrical engineering, electromechanics and electronics. The flux is characterized by high temperature stability and does not splash during melting. Optimum wetting as well as spreading values exceeding standards make this lead-free solder wire a top product among the tube solders.The new flux formulation .Clearg is based on synthetic resins (free of rosin) and has been perfectly adapted to the new needs of lead-free soldering technology: high wetting speed and spreading on all surfaces commonly used in electronics no (painful) flux splashes on the assembly, system parts or the user's hands crystal-clear flux residues for optimisation of the optical impression Lowest outgassing and neutral odour reduces workplace pollution easily removable residues on soldering tips, these can be removed with conventional means (FELDER tinner, solder sponge, metal wool) 100MĦ test passed - can also be used in assembly production The service life of the soldering iron tips is noticeably extendedAlloy Sn96.5 Ag3.0 Cu0.5

Copper desoldering braid for optimum extraction of solder.• Width: approx. 1.5 mm• Length: approx. 1.5 m

Desoldering litz made of copper for optimal extraction of solder.Width: approx. 2.5 mmLength: approx. 1.6 m

Soldering wire ISO-Core ''Ultra-clear''High-quality, halogen-free, lead-free soldering wire for hand and automatic soldering in electronics, electrical engineering and electromechanics. The flux is characterized by high temperature resistance and does not spray during melting. An optimal wetting as well as spreading values that exceed the standard make this halogen-free soldering wire a top product among the lead-free tube solders. The new flux formulation ''Ultra-clear'' is based on synthetic resins (free of rosin) and has been perfectly adapted to the requirements of lead-free soldering technology in assembly production:High wetting speed and spread on all surfaces common in electronicsNo flux splashes on the assembly, system parts or the hands of the user(s)Glass-clear flux residues for optimizing the optical impressionThe lowest level of gasification and neutral odor reduces workplace stressEasily removable residues on soldering tips, these can be removed with conventional means (FIELDS Tinner, soldering sponge, metal wool)REL0 Flux type according to J-STD-004 and DIN EN 61190-1-3 for assembly productionThe service life of the soldering iron tips is noticeably longer Alloy: Sn96,5Ag3.0Cu0.52.2% Flux ContentLead-free: YesMelting point 217 - 219° C.

Copper desoldering braid for optimum extraction of solder.• Width: approx. 2.5 mm• Length: approx. 15 m

Solder wire, ''Ultra-Clear'' ISO coreAlloy: Sn96.5/Ag3.0/Cu0.5Flux content: 2.2%Lead-free: YesMelting point: 217 - 219°C

Copper desoldering braid for optimum extraction of solder.• Width: approx. 1.5 mm• Length: approx. 30 m

ISO-Cream® ''Clear'' lead-free SMD solder paste is a homogeneous, ready-to-use, low-odour mixture of metal powder, binders, solvents and flux powder. It is free of any thixotropic agents, ensuring stable viscosity. This paste has excellent wetting properties and is also great for soldering problematic surfaces such as chem. Ni/Au, chem. AG or OSP. Colourless flux powder residues Low flux spreading First-class wetting on all known surfaces Barely any escape for larger cleaning intervals of the reflow oven Genuine no-clean quality Excellent print quality Long service life of at least 72 hours Perfect soldering results with different soldering profiles Insensitive to environmental influences Retains viscosity even during pressure breaksProduct featuresAlloy: Sn96.5Ag3.0Cu0.5Lead-free: Yes

Copper desoldering braid for optimum extraction of solder.• Width: approx. 2.0 mm• Length: approx. 1.6 m

Copper desoldering braid for optimum extraction of solder.• Width: approx. 2.0 mm• Length: approx. 30 m

Solder wire, ''Ultra-Clear'' ISO coreAlloy: Sn96.5/Ag3.0/Cu0.5Flux content: 2.2%Lead-free: YesMelting point: 217 - 219°C

Flux cored, lead-free soft solder wire for electronic manufacturing, flux type according to DIN EN 61190: REM1, according to DIN EN 29454: 1.2.2.BHigh-quality lead-free solder wire for manual and automatic soldering in the areas of electrical engineering, electromechanics and electronics. The flux is characterized by high temperature resistance and does not spatter when melted. Optimal wetting and a higher than average solder spread rate makes this lead-free solder wire a top-quality product in its class.The new clear flux recipe is based on synthetic resins (free from colophony) and has been perfectly tailored to the new requirements regarding lead-free soldering:• High wetting speed and spreads across all conventional electronic surfaces• No (harmful) flux spatter on the components, equipment or the hands of the user• Crystal-clear flux residue to optimise visual appearance• Lowest possible emission of solder fumes and neutral odour reduces contamination of the work area• Easy to remove residue from soldering tips using conventional means (FELDER Tinner, solder sponge, metal wool)• Tested up to 100 Mƒ — can also be used in the production of components• The service life of the soldering iron tips is extended considerablySn96,5 Ag3,0 Cu0,5

Flux-cored, lead-free soft solder wire for electronic manufacturing, flux type according to DIN EN 61190: REM1, according to DIN EN 29454: 1.2.2.BHigh-quality, lead-free solder wire for manual and automatic soldering in the areas of electrical engineering, electromechanics and electronics. The flux is characterised by high temperature resistance and does not spatter when melted. Optimal wetting and a higher than average solder spread rate makes this lead-free solder wire a top-quality product in its class.The new clear flux recipe is based on synthetic resins (free from colophony) and has been perfectly tailored to the new requirements regarding lead-free soldering:• High wetting speed and spreads across all conventional electronic surfaces• No (harmful) flux spatter on the components, equipment or the user's hands• Crystal-clear flux residues to optimise visual appearance• Lowest possible emission of fumes and neutral odour reduces workplace contamination• Residue easily removed from soldering tips using conventional means (FELDER Tinner, solder sponge, metal wool)• Tested up to 100 Mƒ — can also be used in the production of components• The service life of the soldering iron tips is considerably extended

Solder wire, ''Ultra-Clear'' ISO coreHigh wetting rate, spreads across all conventional electronic surfacesNo flux spatter on the components, equipment or the operator's handsCrystal-clear flux residue to improve appearanceMinimal emission of fumes and neutral odour reduces workplace contaminationResidue easily removed from soldering tips using conventional means (FELDER Tinner, solder sponge, steel wool)Flux type REL0 in accordance with J-STD-004 and DIN EN 61190-1-3 for component productionThe service life of the soldering iron tips is extended considerably Alloy: Sn99.3 CuNiGe, according to Fuji DE patent no. 19816671C2, Sn99.25/Cu0.7/Ni0.05, EN ISO 9452:2014Flux content: 2.2%Lead-free: YesMelting point: 227°C

Solder wire, ''Ultra-Clear'' ISO coreHigh wetting rate, spreads across all conventional electronic surfacesNo flux spatter on the components, equipment or the operator's handsCrystal-clear flux residue to improve appearanceMinimal emission of fumes and neutral odour reduces workplace contaminationResidue easily removed from soldering tips using conventional means (FELDER Tinner, solder sponge, steel wool)Flux type REL0 in accordance with J-STD-004 and DIN EN 61190-1-3 for component productionThe service life of the soldering iron tips is extended considerably Alloy: Sn99.3 CuNiGe, according to Fuji DE patent no. 19816671C2, Sn99.25/Cu0.7/Ni0.05, EN ISO 9452:2014Flux content: 2.2%Lead-free: YesMelting point: 227°C

Copper desoldering braid for optimum extraction of solder.• Width: approx. 1 mm• Length: approx. 1.6 m

Solder wire, ''Ultra-Clear'' ISO coreHigh wetting rate, spreads across all conventional electronic surfacesNo flux spatter on the components, equipment or the operator's handsCrystal-clear flux residue to improve appearanceMinimal emission of fumes and neutral odour reduces workplace contaminationResidue easily removed from soldering tips using conventional means (FELDER Tinner, solder sponge, steel wool)Flux type REL0 in accordance with J-STD-004 and DIN EN 61190-1-3 for component productionThe service life of the soldering iron tips is extended considerably Alloy: Sn99.3 CuNiGe, according to Fuji DE patent no. 19816671C2, Sn99.25/Cu0.7/Ni0.05, EN ISO 9452:2014Flux content: 2.2%Lead-free: YesMelting point: 227°C

Paste-like flux-powder based on zinc chloride and ammonium chloride for soft soldering of copper and copper alloys during copper pipe installation, radiator construction, plumbing work, dip soldering, fittings manufacture and other soldering work.

Flux-filled, lead-free soft solder wire for electronics production Flux type according to DIN EN 61190: REM1, according to DIN EN 29454: 1.2.2.BHigh-quality lead-free solder wire for manual and automatic soldering in electrical engineering, electromechanics and electronics. The flux is characterized by high temperature stability and does not splash during melting. Optimum wetting as well as spreading values exceeding standards make this lead-free solder wire a top product among the tube solders.The new flux formula .Clearg is based on synthetic resins (free of rosin) and has been perfectly adapted to the new needs of lead-free soldering technology:• high wetting speed and spreading on all surfaces commonly used in electronics.bulletpoint# no (painful) flux splashes on the assembly, system parts or the user's hands• crystal clear flux residues to optimize the optical impression• lowest outgassing and neutral odour reduces workplace pollution• easily removable residues on soldering tips, these can be removed with conventional means (FELDER Tinner, solder sponge, metal wool)• 100Mƒ¶-test passed- can also be used in assembly production• The service life of the soldering iron tips is noticeably extendedSn96.5 Ag3.0 Cu0.5

Flux-cored, lead-free soft solder wire for electronic manufacturing, flux type according to DIN EN 61190: REM1, according to DIN EN 29454: 1.2.2.BHigh-quality, lead-free solder wire for manual and automatic soldering in the areas of electrical engineering, electromechanics and electronics. The flux is characterised by high temperature resistance and does not spatter when melted. Optimal wetting and a higher than average solder spread rate makes this lead-free solder wire a top-quality product in its class.The new clear flux recipe is based on synthetic resins (free from colophony) and has been perfectly tailored to the new requirements regarding lead-free soldering:• High wetting speed and spreads across all conventional electronic surfaces• No (harmful) flux spatter on the components, equipment or the user's hands• Crystal-clear flux residues to optimise visual appearance• Lowest possible emission of fumes and neutral odour reduces workplace contamination• Residue easily removed from soldering tips using conventional means (FELDER Tinner, solder sponge, metal wool)• Tested up to 100 Mƒ — can also be used in the production of components• The service life of the soldering iron tips is considerably extended