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Soldering wire ISO-Core ''Ultra-clear''High-quality, halogen-free, lead-free soldering wire for hand and automatic soldering in electronics, electrical engineering and electromechanics. The flux is characterized by high temperature resistance and does not spray during melting. An optimal wetting as well as spreading values that exceed the standard make this halogen-free soldering wire a top product among the lead-free tube solders. The new flux formulation ''Ultra-clear'' is based on synthetic resins (free of rosin) and has been perfectly adapted to the requirements of lead-free soldering technology in assembly production:High wetting speed and spread on all surfaces common in electronicsNo flux splashes on the assembly, system parts or the hands of the user(s)Glass-clear flux residues for optimizing the optical impressionThe lowest level of gasification and neutral odor reduces workplace stressEasily removable residues on soldering tips, these can be removed with conventional means (FIELDS Tinner, soldering sponge, metal wool)REL0 Flux type according to J-STD-004 and DIN EN 61190-1-3 for assembly productionThe service life of the soldering iron tips is noticeably longer Alloy: Sn96,5Ag3.0Cu0.52.2% Flux ContentLead-free: YesMelting point 217 - 219° C.

Solder wire, ''Ultra-Clear'' ISO coreAlloy: Sn96.5/Ag3.0/Cu0.5Flux content: 2.2%Lead-free: YesMelting point: 217 - 219°C

ISO-Cream® ''Clear'' lead-free SMD solder paste is a homogeneous, ready-to-use, low-odour mixture of metal powder, binders, solvents and flux powder. It is free of any thixotropic agents, ensuring stable viscosity. This paste has excellent wetting properties and is also great for soldering problematic surfaces such as chem. Ni/Au, chem. AG or OSP. Colourless flux powder residues Low flux spreading First-class wetting on all known surfaces Barely any escape for larger cleaning intervals of the reflow oven Genuine no-clean quality Excellent print quality Long service life of at least 72 hours Perfect soldering results with different soldering profiles Insensitive to environmental influences Retains viscosity even during pressure breaksProduct featuresAlloy: Sn96.5Ag3.0Cu0.5Lead-free: Yes

ISO-Cream® ''Clear'' lead-free SMD solder paste is a homogeneous, ready-to-use, low-odour mixture of metal powder, binders, solvents and flux powder. It is free of any thixotropic agents, ensuring stable viscosity. This paste has excellent wetting properties and is also great for soldering problematic surfaces such as chem. Ni/Au, chem. AG or OSP. Colourless flux powder residues Low flux spreading First-class wetting on all known surfaces Barely any escape for larger cleaning intervals of the reflow oven Genuine no-clean quality Excellent print quality Long service life of at least 72 hours Perfect soldering results with different soldering profiles Insensitive to environmental influences Retains viscosity even during pressure breaksProduct featuresAlloy: Sn96.5Ag3.0Cu0.5Lead-free: YesSMD solder paste ISO-Cream ''Clear'',Sn96.5Ag3.0Cu0.5, DIN EN ISO 9453,Flux DIN EN 29454, 1.2.3.C (REL0),Metal content: 85%, grain size 4,

Flux for general soldering work on all metallic surfaces, with the exception of aluminium and stainless steels.Type in accordance with EN ISO 9454-1:2016

Copper desoldering braid for optimum extraction of solder.• Width: approx. 2.0 mm• Length: approx. 30 m

Flux for general soldering work on all metallic surfaces, with the exception of aluminium and stainless steels.Type in accordance with EN ISO 9454-1:2016

Copper desoldering braid for optimum extraction of solder.• Width: approx. 2.0 mm• Length: approx. 1.6 m

Copper desoldering braid for optimum extraction of solder.• Width: approx. 1 mm• Length: approx. 1.6 m

Copper desoldering braid for optimum extraction of solder.• Width: approx. 2.5 mm• Length: approx. 15 m

Copper desoldering braid for optimum extraction of solder.• Width: approx. 1.5 mm• Length: approx. 30 m

Paste-like flux-powder based on zinc chloride and ammonium chloride for soft soldering of copper and copper alloys during copper pipe installation, radiator construction, plumbing work, dip soldering, fittings manufacture and other soldering work.

FELDER-Tinner, BLEIFREI,Flußmittel DIN EN 29454, 1.2.3.B, ca. 15 g Dosen, (mit Klebepad an der Unterseite)Zum Reinigen und Verzinnen von bleifeien LötspitzenVerpresstes Metallpulver Sn97Cu3 mit anorganischen AktivatorenDer FELDER TINNER „bleifrei“ besteht aus einem Gemisch von Lötaktivatoren, Bindemitteln und bleifreiem Lötzinnpulver. Der TINNER „bleifrei“ verzinnt, reinigt und schützt Lötkolbenspitzen unkompliziert und ohne lästige Rauchentwicklung (Salmiakfrei).Eigenschaftensalmiakfrei (keine gesundheitsschädlichen Dämpfe)bleifreierhöht die Standzeit der Lötspitzenlange Haltbarkeitpraktisch in wiederverschließbarer Blechdose mit Klebepad auf dem Dosenbodeneinfachste AnwendungLegierung : Sn97Cu3 (DIN EN ISO 9453)Dichte (20°C) : 2,77g/cm³Schmelzpunktpunkt : 230 - 310°CFarbe : silbergrauDer FELDER TINNER “bleifrei“ sollte hauptsächlich vor Arbeitspausen und vor Arbeitende verwendet werden. Die Lötspitze sollte eine Temperatur von 250°C bis ca. 400°C haben, damit der Verzinnungsvorgang optimal ablaufen kann.Um beste Reinigungsergebnisse zu erzielen, sollte die heiße Lötkolbenspitze kurz in den Tinner eingetaucht werden bis dieser an der Spitze aufschmilzt und diese benetzt. Danach eventuelle, lose anhaftende Aktivierungsrückstände mit einem Metallschwamm entfernen und den Lötkolben ausschalten.Im Gegensatz zu bleihaltigen Lötprozessen, bitte keinen nassen Reinigungsschwamm verwenden!

Copper desoldering braid for optimum extraction of solder.• Width: approx. 1.5 mm• Length: approx. 1.5 m

Paste-like flux-powder based on zinc chloride and ammonium chloride for soft soldering of copper and copper alloys during copper pipe installation, radiator construction, plumbing work, dip soldering, fittings manufacture and other soldering work.

Paste-like flux-powder based on zinc chloride and ammonium chloride for soft soldering of copper and copper alloys during copper pipe installation, radiator construction, plumbing work, dip soldering, fittings manufacture and other soldering work.

Desoldering litz made of copper for optimal extraction of solder.Width: approx. 2.5 mmLength: approx. 1.6 m

Environmentally-friendly lead-free, lead-free soldering wire with silver and copper content/halogen-freeFlux-cored, halogen-free activated soft soldering wire Flux in accordance with DIN EN 29454.1 , 1.1.3.B and DIN EN 61190-1-3, ROL0.No-clean standard soldering wire for manual hand soldering in electronics, standard flux-core percentage 3.5%.• Ø: 1.5 mm• Quantity: approx. 250 g• Structure: Sn95.5 Ag3.8 Cu0.7 F-SW32 (1.1.3.B)• Halogen-free• Minimal smoke generation• Use in SMD technology• Melting point: 217°CIt has no longer been permissible since 2006 to use lead in solder!The NO-CLEAN solution with continuous flux cores- cleaning of solder points after soldering no longer necessary.

Environmentally-friendly, lead-free soldering wire with silver and copper content on reel.Flux-cored, halogen-free activated soft soldering wire Flux in accordance with DIN EN 29454.1 , 1.1.3.B and DIN EN 61190-1-3, ROL0.No-clean standard soldering wire for manual hand soldering in electronics, standard flux-core percentage 3.5%.• Ø: 0.5 mm• Quantity: approx. 250 g• Structure: Sn95.5 Ag3.8 Cu0.7 F-SW32 (1.1.3.B)• Halogen-free• Minimal smoke generation• Use in SMD technologyIt has no longer been permissible since 2006 to use lead in solder!The NO-CLEAN solution with continuous flux cores- cleaning of solder points after soldering no longer necessary.Lead-free with silver and copper content/halogen-free

Environmentally-friendly, lead-free soldering wire with silver and copper content on reel.Flux-cored, halogen-free activated soft soldering wire Flux in accordance with DIN EN 29454.1 , 1.1.3.B and DIN EN 61190-1-3, ROL0.No-clean standard soldering wire for manual hand soldering in electronics, standard flux-core percentage 3.5%.• Ø: 0.35 mm• Quantity: approx. 100 g• Structure: Sn95.5 Ag3.8 Cu0.7 F-SW32 (1.1.3.B)• Halogen-free• Minimal smoke generation• Use in SMD technologyIt has no longer been permissible since 2006 to use lead in solder!The NO-CLEAN solution with continuousflux cores- cleaning of solder points after soldering no longer necessary.Lead-free with silver and copper content/halogen-free