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Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance Provides the latest research on potential solutions, with an eye towards the end goal of system integration Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates

This revised and expanded edition emphasizes the basic concepts underlying the analysis and design of all discrete and integrated circuits. Contains an extensive treatment of semiconductor fundamentals; new material on power supplies and Schottky barrier diodes including useful models for diodes in avalanche breakdown and cutoff; a more accurate linear model for the biopolar transistor; the concept of the Early voltage; and an improved account of frequency response. Features two new chapters devoted to the operational amplifier and its specifications and the use of the op-amp, with a number of its important applications such as voltage references, comparators, differentiators and intergrators. Many of the examples and all of the problems are new.

This revised and expanded edition emphasizes the basic concepts underlying the analysis and design of all discrete and integrated circuits. Contains an extensive treatment of semiconductor fundamentals; new material on power supplies and Schottky barrier diodes including useful models for diodes in avalanche breakdown and cutoff; a more accurate linear model for the biopolar transistor; the concept of the Early voltage; and an improved account of frequency response. Features two new chapters devoted to the operational amplifier and its specifications and the use of the op-amp, with a number of its important applications such as voltage references, comparators, differentiators and intergrators. Many of the examples and all of the problems are new.

This revised and expanded edition emphasizes the basic concepts underlying the analysis and design of all discrete and integrated circuits. Contains an extensive treatment of semiconductor fundamentals; new material on power supplies and Schottky barrier diodes including useful models for diodes in avalanche breakdown and cutoff; a more accurate linear model for the biopolar transistor; the concept of the Early voltage; and an improved account of frequency response. Features two new chapters devoted to the operational amplifier and its specifications and the use of the op-amp, with a number of its important applications such as voltage references, comparators, differentiators and intergrators. Many of the examples and all of the problems are new.

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance Provides the latest research on potential solutions, with an eye towards the end goal of system integration Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates