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Chinese Gong. Origin Country: China. 5 lbs. Made by Mid-East. DOBANI Bao Gong 13.75" (35cm) w/ Beater WBG14

Chinese Gong. Origin Country: China. 7 lbs. Made by Mid-East. DOBANI Bao Gong 17.75" (45cm) w/ Beater WBG18

Chinese Gong. Origin Country: China. 7 lbs. Made by Mid-East.

Chinese Gong. Origin Country: China. 5 lbs. Made by Mid-East.

Alloy: B20Weight: ThinSound profile: Dark, fullSustain: LongBell: Medium<iframe width="560" height="315" src="https://www.youtube.com/embed/wbg...

ProX XTC-SQ656TS-WBG WHITE 6.56ft 2 meter Lycra Cover Scrim Sleeve fits 12" Quad Box Truss Segment Description The ProX XTC-SQ6...

Alloy: B20Weight: ThinSound profile: Dark, fullSustain: LongBell: Medium<iframe width="560" height="315" src="https://www.youtube.com/embed/wbg...

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance Provides the latest research on potential solutions, with an eye towards the end goal of system integration Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates

XI, 330, 153 S. : Ill., graph. Darst., Kt. ; 31 cm + Beil. (7 Bl. : überw. Ill.), Orig.-Pappband. Archäologie in Eurasien ; Bd. 26. Steppenvölker Eurasiens ; Bd. 3. Literaturangaben. Kontaktdaten des Herstellers: wbg Philipp von Zabern in der Verlag Herder GmbH Hermann-Herder-Str. 4 Freiburg 79104 DE kundenservice(at)herder(.)de

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance Provides the latest research on potential solutions, with an eye towards the end goal of system integration Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates